硬件工程师

岗位信息

关键工作要素

该人员的关键角色是成为工程设计团队的个人贡献者。在某些情况下，该工程师是设计的首席工程师，或作为设计的一部分接受首席工程师的指导。在所有情况下，都需要密切合作，以确保最终产品的质量。

该工程师将负责复杂的板级设计，包括尖端电源、加工和开关硅。设计机会广泛，包括高速数字电路（包括以太网、USB、PCIe和SAS/SATA接口）、大功率开关电源、以太网交换子系统、FPGA和基于Intel的处理器子系统。

必须具备与本地有才华、经验丰富的团队合作并实施复杂设计的能力。具备良好的中英文沟通能力。

该工程师将参与开发的所有阶段，包括系统分析、规范、设计、验证和生产发布。

资格

电气工程或计算机工程学士/硕士或同等工作经验。

至少6年的电路板级硬件设计经验。在复杂计算产品的设计中必须有大量的经验。

需要对硬件工程过程和质量控制有深入的了解。

强烈要求具备相关高速电路设计的广泛知识，包括数字和模拟设计、DC-DC转换器、信号完整性等。

需要具备领导一个小型工程师和技术人员团队的能力，以及与跨职能和跨地域团队合作的能力。

有英特尔硅和COM-E、笔记本电脑主板、服务器主板或ATCA计算刀片开发经验者优先。

需要有Cadence概念和Allegro工具的设计经验。

有CPLD/FPGA开发经验者优先。

具备在中国境内和国际上自由旅行的能力。

需要具备快速学习新概念和新学科的能力。

必须有上进心、团队精神、责任心、创新精神，能够独立工作，很少或没有方向。

有强烈的责任感和团队合作精神

良好的英语和普通话沟通和表达能力。这包括用英语编写规范、测试计划和报告。

必须具备跨多个职能专业与整个组织顺利合作的能力，尤其是工程和营销团队，以及跨国际网站进行协调互动的能力。

地点：

该职位位于中国上海。


Critical Job Elements

The key role for this person is to be an individual contributor for an engineering design team. In some cases this engineer is the lead engineer for a design or will take direction from a lead engineer as contribute portions of the design. In all cases close collaboration is required to ensure the quality of the final product.
This Engineer will be responsible for complex board level designs incorporating cutting edge power supply, processing and switching silicon. The design opportunities are broad including high speed digital circuits (which include Ethernet, USB, PCIe, and SAS/SATA interfaces), high power switching power supplies, Ethernet switching subsystems, FPGAs, and Intel based processor subsystems.
The ability to work with a talented, experienced team locally and to implement complex designs is a must. Feasible communication skills are required in both Mandarin and English.
This engineer will contribute to all phases of development including system analysis, specification, design, verification and release to manufacturing.

Qualifications
BS/MS in Electrical Engineering, or Computer Engineering or equivalent work experience is required.
At least 6 years of board level hardware design is required. A significant amount of this experience must be in the design of complex computing products.
Deep understanding of hardware engineering process and quality control is required.
Extensive knowledge of associated high speed circuit design including digital and analog design, DC-DC converter, signal integrity, etc. is strongly desired.
Proven ability to lead a small team of engineers and technicians and ability to work with cross-functional and cross-geographic teams is highly desired.
Experience with Intel silicon and COM-E, laptop motherboard, server motherboard, or ATCA computing blade development is highly desired.
Design experience with Cadence concept & Allegro tools is desired.
Experience in CPLD/FPGA development is a plus.
Ability to travel freely within China and internationally is required.
Ability to learn new concepts and disciplines very quickly is required.
Must be self-motivated, team oriented, accountable, innovative and able to work independently with little or no direction.
Have a strong sense of responsibility and commitment to teamwork
Good communication & presentation skills both in English and Mandarin are required. This includes writing specifications, test plans and reports in English.
Must have ability to work smoothly with the entire organization across multiple functional specialties, especially engineering and marketing teams and the ability to interact cohesively across International sites.


Location:
Position is available in Shanghai, China.